IEI Industrial Partner

Wafer-5822 - IEI WAFER-5822 3.5" Disk Size GX1-300 Embedded Board, with 10/100Mbps...

larger image

Request Quote
For Price
Part Number:
Wafer-5822
Model Number:
Wafer-5822
Make:
IEI
Lead Time:
Available
Qty In Stock:
Available

IEI WAFER-5822 3.5" Disk Size GX1-300 Embedded Board, with 10/100Mbps Ethernet, LCD/CRT VGA, CPU & Audio Simple Type: CPU Board

Download the datasheet (PDF)

For Resellers and High Volume Orders:
Please request a quote to obtain preferred pricing.

Features

  • 1x PC133 SDRAM SO-DIMM support up to 512MB
  • CRT/LCD integrated in CS5530A, support 18-bit TFT LCD, LVDS (5820), TV-Out(5822)
  • DOC, LAN, USB, Audio integrated
  • Embedded AMD Geode GX1-300 CPU for Fanless system support
  • Support PC/104 extension slot

Specifications

    General
  • 1 x ATA-33 IDE channel (44-pin by pin-header)
  • 1 x FDD port
  • 1 x IrDA port
  • 1 x parallel port (support SPP/EPP/ECP mode)
  • 2 x USB 1.1 (by pin-header)
  • 44-pin pin-header for TFT LCD
  • Connector : DB-15 for CRT display
  • Resolution :1280 x 1024 (256 colors)
  • TV Out (Both NTSC & PAL)
  • V-RAM : Share with system memory (up to 4MB), setting in BIOS
  • Audio: AC '97 compliant Audio CODEC
  • BIOS: Award PnP Flash BIOS
  • CPU: Embedded AMD Geode GX1 300MHz
  • Digital I/O: 4 x DI & 4 x DO, TTL Level
  • Display: Built-in CS5530A chipset, supports TFT LCD & CRT display
  • Ethernet: Single 10/100Mbps Realtek RTL8100BL Fast Ethernet controller
  • GW: 700g
  • I/O: 2 x RS-232 ports
  • Operating Temperature: 0~60?
  • Power Consumption: +5V@2A, +12V@100mA (GXLV 233MHz CPU and 32MB SDRAM)
  • Processor: AMD Geode GX1
  • Relative Humidity: 5~95%, non-condensing
  • SSD: One DiskOnChip socket
  • System Chipset: AMD Geode GX1 + CS5530A
  • System Memory: One 144-pin SO-DIMM socket supports up to 256MB SDRAM
  • WDT: Software programmable, support 1~ 255 sec. system reset

 

Applications

  • None Available

Aliases

  • None Available